DocumentCode :
1864602
Title :
CMOS/BiCMOS power amplifier technology trend in Japan
Author :
Suematsu, N. ; Shinjo, S.
Author_Institution :
Inf. R&D Center, Mitsubishi Electr. Corp., Kanagawa, Japan
fYear :
2001
fDate :
21-24 Oct. 2001
Firstpage :
107
Lastpage :
110
Abstract :
Aiming for 2-5GHz band transceiver system on a chip, the integration of RF section has been developed by using conventional CMOS/BiCMOS (SiGeCMOS) process. The attempts to integrate power amplifiers (PA´s) have been successful for low transmit power system such as Bluetooth, but these attempts are very limited due to the poor power handling capability of FET´s in CMOS and the distortion characteristics of BJT´s(HBT´s) in BiCMOS. From the point of view of a circuit designer, this paper reviews the recent research activities of CMOS/BiCMOS PA´s in Japan, and also describes the details of (1) the feasibility study of PA´s using conventional CMOS process, and (2) the circuitry trials of distortion reduction for BJT(HBT) PA´s.
Keywords :
BiCMOS analogue integrated circuits; CMOS analogue integrated circuits; UHF integrated circuits; UHF power amplifiers; electric distortion; transceivers; 2 to 5 GHz; BJT; BiCMOS power amplifier; Bluetooth; CMOS power amplifier; FET; HBT; Japan; RF IC technology; SiGe; circuit design; distortion characteristics; transceiver chip; wireless communication; BiCMOS integrated circuits; Bluetooth; CMOS process; CMOS technology; FETs; Power amplifiers; Power systems; Radio frequency; Radiofrequency amplifiers; Transceivers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, 2001. 23rd Annual Technical Digest
Conference_Location :
Baltimore, MD, USA
ISSN :
1064-7775
Print_ISBN :
0-7803-6663-8
Type :
conf
DOI :
10.1109/GAAS.2001.964357
Filename :
964357
Link To Document :
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