• DocumentCode
    1864741
  • Title

    Self-aligned electrostatic angular vertical comb actuators assembled on-chip using in-plane electrothermal actuators

  • Author

    Eun, Y. ; Na, H. ; Choi, J. ; Kim, J.

  • Author_Institution
    Sch. of Mech. Eng., Yonsei Univ., Seoul, South Korea
  • fYear
    2009
  • fDate
    21-25 June 2009
  • Firstpage
    908
  • Lastpage
    911
  • Abstract
    We have designed, fabricated and tested self-aligned angular vertical comb-drive (AVC) actuators by on-chip assembly technique using in-plane electrothermal actuators. The AVC actuators are fabricated on a silicon-on-insulator (SOI) wafer using three photomasks and three times of deep etching steps. The maximum optical scan angle of 30.7deg is achieved at 4.56 kHz under the sinusoidal driving voltage of 0~80 V applied to the AVC actuator. After the reliability test performed by operating the actuator for 1.6 times 108 cycles, the measured optical scan angle variation and resonant frequency change were within 8 Hz and 1.1%, respectively.
  • Keywords
    electrostatic actuators; frequency 4.56 kHz; in-plane electrothermal actuators; self-aligned electrostatic angular vertical comb-drive actuators; silicon-on-insulator wafer; Assembly; Automatic testing; Automatic voltage control; Electrostatic actuators; Electrothermal effects; Etching; Frequency measurement; Goniometers; Performance evaluation; Silicon on insulator technology; Angular Vertical Comb-Drive; Electrostatic Actuator; Microscanner; Self-Aligned;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
  • Conference_Location
    Denver, CO
  • Print_ISBN
    978-1-4244-4190-7
  • Electronic_ISBN
    978-1-4244-4193-8
  • Type

    conf

  • DOI
    10.1109/SENSOR.2009.5285921
  • Filename
    5285921