DocumentCode :
1864741
Title :
Self-aligned electrostatic angular vertical comb actuators assembled on-chip using in-plane electrothermal actuators
Author :
Eun, Y. ; Na, H. ; Choi, J. ; Kim, J.
Author_Institution :
Sch. of Mech. Eng., Yonsei Univ., Seoul, South Korea
fYear :
2009
fDate :
21-25 June 2009
Firstpage :
908
Lastpage :
911
Abstract :
We have designed, fabricated and tested self-aligned angular vertical comb-drive (AVC) actuators by on-chip assembly technique using in-plane electrothermal actuators. The AVC actuators are fabricated on a silicon-on-insulator (SOI) wafer using three photomasks and three times of deep etching steps. The maximum optical scan angle of 30.7deg is achieved at 4.56 kHz under the sinusoidal driving voltage of 0~80 V applied to the AVC actuator. After the reliability test performed by operating the actuator for 1.6 times 108 cycles, the measured optical scan angle variation and resonant frequency change were within 8 Hz and 1.1%, respectively.
Keywords :
electrostatic actuators; frequency 4.56 kHz; in-plane electrothermal actuators; self-aligned electrostatic angular vertical comb-drive actuators; silicon-on-insulator wafer; Assembly; Automatic testing; Automatic voltage control; Electrostatic actuators; Electrothermal effects; Etching; Frequency measurement; Goniometers; Performance evaluation; Silicon on insulator technology; Angular Vertical Comb-Drive; Electrostatic Actuator; Microscanner; Self-Aligned;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
Conference_Location :
Denver, CO
Print_ISBN :
978-1-4244-4190-7
Electronic_ISBN :
978-1-4244-4193-8
Type :
conf
DOI :
10.1109/SENSOR.2009.5285921
Filename :
5285921
Link To Document :
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