DocumentCode
1864741
Title
Self-aligned electrostatic angular vertical comb actuators assembled on-chip using in-plane electrothermal actuators
Author
Eun, Y. ; Na, H. ; Choi, J. ; Kim, J.
Author_Institution
Sch. of Mech. Eng., Yonsei Univ., Seoul, South Korea
fYear
2009
fDate
21-25 June 2009
Firstpage
908
Lastpage
911
Abstract
We have designed, fabricated and tested self-aligned angular vertical comb-drive (AVC) actuators by on-chip assembly technique using in-plane electrothermal actuators. The AVC actuators are fabricated on a silicon-on-insulator (SOI) wafer using three photomasks and three times of deep etching steps. The maximum optical scan angle of 30.7deg is achieved at 4.56 kHz under the sinusoidal driving voltage of 0~80 V applied to the AVC actuator. After the reliability test performed by operating the actuator for 1.6 times 108 cycles, the measured optical scan angle variation and resonant frequency change were within 8 Hz and 1.1%, respectively.
Keywords
electrostatic actuators; frequency 4.56 kHz; in-plane electrothermal actuators; self-aligned electrostatic angular vertical comb-drive actuators; silicon-on-insulator wafer; Assembly; Automatic testing; Automatic voltage control; Electrostatic actuators; Electrothermal effects; Etching; Frequency measurement; Goniometers; Performance evaluation; Silicon on insulator technology; Angular Vertical Comb-Drive; Electrostatic Actuator; Microscanner; Self-Aligned;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
Conference_Location
Denver, CO
Print_ISBN
978-1-4244-4190-7
Electronic_ISBN
978-1-4244-4193-8
Type
conf
DOI
10.1109/SENSOR.2009.5285921
Filename
5285921
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