DocumentCode
1864839
Title
A novel monolithically integrated pressure, accelerometer and temperature composite sensor
Author
Wang, Quan ; Li, Xinxin ; Tie Li ; Bao, Minhang ; Zhang, Kun ; Ge, Xiaohong ; Zhou, Wei ; Haifei Bao
Author_Institution
State Key Lab. of Transducer Technol., Chinese Acad. of Sci., Shanghai, China
fYear
2009
fDate
21-25 June 2009
Firstpage
1118
Lastpage
1121
Abstract
The paper presents a novel single-side micromachined composite sensor, with a piezoresistive pressure sensor, a thermal-convection accelerometer and a thermometer monolithically integrated in one 2.5times2.5 mm2 chip, for low-cost production and applications such as tire-pressure monitoring systems (TPMS). The accelerometer is based on heat convection, including a micro heater and two pairs of micro machined thermopile sensors for temperature difference sensing. The convective accelerometer sensitivities at the heater power of 10.90mW, 19.56 mW and 30.12 mW are 37.92 muv/g, 85.04 muv/g and 134.08 muv/g, respectively. The pressure sensor sensitivity range 450 KPa is about 0.038 mV/V/KPa .The nonlinearity is less than plusmn1.06% FS (full scale) and even in over load case of 700 KPa nonlinearity is under plusmn 1.62% FS. In this boron ion implantation case, the temperature coefficient of polysilicon resistor is -578 ppm/degC.
Keywords
accelerometers; boron; ion implantation; microsensors; pressure sensors; thermometers; thermopiles; accelerometer; boron ion implantation; composite sensor; heat convection; microheater; piezoresistive sensor; power 10.9 mW; power 19.56 mW; power 30.12 mW; pressure sensor; size 2.5 mm; temperature coefficient; temperature sensor; thermometer; thermopile sensors; tire-pressure monitoring; Accelerometers; Boron; Ion implantation; Monitoring; Piezoresistance; Production systems; Sensor systems and applications; Temperature distribution; Temperature sensors; Thermal sensors; Convective accelerometer; LS SiN; polysilicon resistor; pressure sensor; temperature sensor;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
Conference_Location
Denver, CO
Print_ISBN
978-1-4244-4190-7
Electronic_ISBN
978-1-4244-4193-8
Type
conf
DOI
10.1109/SENSOR.2009.5285926
Filename
5285926
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