DocumentCode :
1864839
Title :
A novel monolithically integrated pressure, accelerometer and temperature composite sensor
Author :
Wang, Quan ; Li, Xinxin ; Tie Li ; Bao, Minhang ; Zhang, Kun ; Ge, Xiaohong ; Zhou, Wei ; Haifei Bao
Author_Institution :
State Key Lab. of Transducer Technol., Chinese Acad. of Sci., Shanghai, China
fYear :
2009
fDate :
21-25 June 2009
Firstpage :
1118
Lastpage :
1121
Abstract :
The paper presents a novel single-side micromachined composite sensor, with a piezoresistive pressure sensor, a thermal-convection accelerometer and a thermometer monolithically integrated in one 2.5times2.5 mm2 chip, for low-cost production and applications such as tire-pressure monitoring systems (TPMS). The accelerometer is based on heat convection, including a micro heater and two pairs of micro machined thermopile sensors for temperature difference sensing. The convective accelerometer sensitivities at the heater power of 10.90mW, 19.56 mW and 30.12 mW are 37.92 muv/g, 85.04 muv/g and 134.08 muv/g, respectively. The pressure sensor sensitivity range 450 KPa is about 0.038 mV/V/KPa .The nonlinearity is less than plusmn1.06% FS (full scale) and even in over load case of 700 KPa nonlinearity is under plusmn 1.62% FS. In this boron ion implantation case, the temperature coefficient of polysilicon resistor is -578 ppm/degC.
Keywords :
accelerometers; boron; ion implantation; microsensors; pressure sensors; thermometers; thermopiles; accelerometer; boron ion implantation; composite sensor; heat convection; microheater; piezoresistive sensor; power 10.9 mW; power 19.56 mW; power 30.12 mW; pressure sensor; size 2.5 mm; temperature coefficient; temperature sensor; thermometer; thermopile sensors; tire-pressure monitoring; Accelerometers; Boron; Ion implantation; Monitoring; Piezoresistance; Production systems; Sensor systems and applications; Temperature distribution; Temperature sensors; Thermal sensors; Convective accelerometer; LS SiN; polysilicon resistor; pressure sensor; temperature sensor;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
Conference_Location :
Denver, CO
Print_ISBN :
978-1-4244-4190-7
Electronic_ISBN :
978-1-4244-4193-8
Type :
conf
DOI :
10.1109/SENSOR.2009.5285926
Filename :
5285926
Link To Document :
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