DocumentCode
1865106
Title
High efficiency selective emitter enabled through patterned ion implantation
Author
Low, Russell ; Gupta, Atul ; Gossmann, Hans-Joachim ; Mullin, James ; Yelundur, Vijay ; Damiani, Ben ; Chandrasekaran, Vinodh ; Meier, Dan ; McPherson, Bruce ; Rohatgi, Ajeet
Author_Institution
Varian Semicond. Equip. Assoc., Gloucester, MA, USA
fYear
2011
fDate
19-24 June 2011
Abstract
This paper discusses the benefits of patterned ion implantation to simplify process flows while enabling a road map to high efficiency cell architectures with lower cost/Watt. The ion implanted selective emitter process, named Solion Blue, is described and the results from the first test run are presented. The process integrates single sided doping with VSEAs in-situ patterned implantation technology while also incorporating a high quality thermal oxide for improved surface passivation of the emitters. The process flow is much simplified over the diffusion based process sequence since the PSG wet etch and edge isolation steps are no longer required due to ion implantation being a single-sided doping technique that forms no glass layer. An added benefit of this approach is the ease of alignment of contacts to selectively doped emitters due to the visible contrast in the differentially doped regions that enables automated optical alignment without any fiducial marks on the surface. Overall, the ion implanted selective emitter cell requires one less processing step than the standard homogeneous emitter process and results in an increase in cell efficiency of up to +1% absolute. Extensive 2D modeling, backed by experimental data, shows further optimization is possible, enabling >;19% performance from this process.
Keywords
ion implantation; passivation; solar cells; PSG wet etch; Solion Blue; VSEA in-situ patterned implantation technology; automated optical alignment; diffusion-based process sequence; edge isolation steps; extensive 2D modeling; high-efficiency selective emitter solar cell; high-quality thermal oxide; homogeneous emitter process; improved surface passivation; patterned ion implantation; process flows; single-sided doping technique; Computer architecture; Doping; Ion implantation; Metals; Microprocessors; Resistance; Semiconductor process modeling;
fLanguage
English
Publisher
ieee
Conference_Titel
Photovoltaic Specialists Conference (PVSC), 2011 37th IEEE
Conference_Location
Seattle, WA
ISSN
0160-8371
Print_ISBN
978-1-4244-9966-3
Type
conf
DOI
10.1109/PVSC.2011.6186328
Filename
6186328
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