• DocumentCode
    1865206
  • Title

    Selective vapor-liquid-solid growth of needle arrays by hotwire chemical vapor deposition with low substrate temperature

  • Author

    Govindarajan, A.V. ; Paluri, S. ; Sharma, A. ; Rao, V. Ramgopal ; Böhringer, K.F.

  • Author_Institution
    Univ. of Washington, Seattle, WA, USA
  • fYear
    2009
  • fDate
    21-25 June 2009
  • Firstpage
    1079
  • Lastpage
    1082
  • Abstract
    We present the technology for low substrate temperature (~400degC) growth of high-density, defect-free (without kinks and branches), unidirectional arrays of Si needles with positive profiles and sub-mum tips using selective vapor-liquid-solid (VLS) mechanism. The low substrate temperature allows possible integration with onchip CMOS circuitry or biomaterials with minimal thermal damage. The effect of processing parameters on needle growth modes is analyzed. Needles with similar characteristics have been successfully grown under the optimized conditions on Si<111>, Si<100> and polysilicon on insulator substrates. We envision these needle arrays (6-8 mum tall, sub-mum tips) as high density electrodes of an integrated retinal implant.
  • Keywords
    CMOS integrated circuits; biomedical materials; chemical vapour deposition; electrodes; nanostructured materials; needles; prosthetics; silicon; Si; biomaterials; high-density electrodes; high-density-defect-free arrays; hotwire chemical vapor deposition; insulator substrates; integrated retinal implant; needle arrays; onchip CMOS circuitry; polysilicon; selective vapor-liquid-solid growth; size 6 mum to 8 mum; thermal damage; unidirectional arrays; CMOS technology; Chemical technology; Chemical vapor deposition; Circuits; Electrodes; Implants; Insulation; Needles; Retina; Temperature; HWCVD; Needles; VLS; low substrate temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
  • Conference_Location
    Denver, CO
  • Print_ISBN
    978-1-4244-4190-7
  • Electronic_ISBN
    978-1-4244-4193-8
  • Type

    conf

  • DOI
    10.1109/SENSOR.2009.5285946
  • Filename
    5285946