DocumentCode
1865206
Title
Selective vapor-liquid-solid growth of needle arrays by hotwire chemical vapor deposition with low substrate temperature
Author
Govindarajan, A.V. ; Paluri, S. ; Sharma, A. ; Rao, V. Ramgopal ; Böhringer, K.F.
Author_Institution
Univ. of Washington, Seattle, WA, USA
fYear
2009
fDate
21-25 June 2009
Firstpage
1079
Lastpage
1082
Abstract
We present the technology for low substrate temperature (~400degC) growth of high-density, defect-free (without kinks and branches), unidirectional arrays of Si needles with positive profiles and sub-mum tips using selective vapor-liquid-solid (VLS) mechanism. The low substrate temperature allows possible integration with onchip CMOS circuitry or biomaterials with minimal thermal damage. The effect of processing parameters on needle growth modes is analyzed. Needles with similar characteristics have been successfully grown under the optimized conditions on Si<111>, Si<100> and polysilicon on insulator substrates. We envision these needle arrays (6-8 mum tall, sub-mum tips) as high density electrodes of an integrated retinal implant.
Keywords
CMOS integrated circuits; biomedical materials; chemical vapour deposition; electrodes; nanostructured materials; needles; prosthetics; silicon; Si; biomaterials; high-density electrodes; high-density-defect-free arrays; hotwire chemical vapor deposition; insulator substrates; integrated retinal implant; needle arrays; onchip CMOS circuitry; polysilicon; selective vapor-liquid-solid growth; size 6 mum to 8 mum; thermal damage; unidirectional arrays; CMOS technology; Chemical technology; Chemical vapor deposition; Circuits; Electrodes; Implants; Insulation; Needles; Retina; Temperature; HWCVD; Needles; VLS; low substrate temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
Conference_Location
Denver, CO
Print_ISBN
978-1-4244-4190-7
Electronic_ISBN
978-1-4244-4193-8
Type
conf
DOI
10.1109/SENSOR.2009.5285946
Filename
5285946
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