Title :
The reliability simulation of space TWT
Author :
Tian Hang ; Xu Hui ; Qi Weiling ; Liu Yiqun ; Pengchao Huang
Author_Institution :
Nanjing Sanle Electron. Group Co., Ltd., Nanjing, China
Abstract :
This paper focuses on the reliability simulation of a space TWT. We do thermal simulation and thermal stress simulation of the overall tube; give the TWT internal temperature distribution and thermal expansion displacement. We have a overall tube of random vibration simulation on the basis of the modal simulation. The simulation results are expected to be used as the basis for product reliability.
Keywords :
reliability; space vehicle electronics; temperature distribution; thermal expansion; thermal stresses; travelling wave tubes; vibrations; TWT internal temperature distribution; modal simulation; product reliability; reliability simulation; space TWT; thermal expansion displacement; thermal stress simulation; travelling wave tubes; vibration simulation; Analytical models; Reliability; Safety; Stress; Thermal expansion; Thermal stresses; Vibrations; ANSYS; random vibration simulation; space TWT; thermal simulation;
Conference_Titel :
Vacuum Electronics Conference (IVEC), 2015 IEEE International
Conference_Location :
Beijing
Print_ISBN :
978-1-4799-7109-1
DOI :
10.1109/IVEC.2015.7224017
