DocumentCode :
1865761
Title :
Parylene to silicon adhesion enhancement
Author :
Huang, R. ; Tai, Y.C.
Author_Institution :
Micromachining Lab., California Inst. of Technol., Pasadena, CA, USA
fYear :
2009
fDate :
21-25 June 2009
Firstpage :
1027
Lastpage :
1030
Abstract :
Parylene-C has been used extensively in neural interface devices as a conformal, biocompatible coating; it has also recently become an integrated part of our parylene-cabled silicon probes. However, it is found over the years that its adhesion capability to silicon may be compromised after thermal treatments, cleaning, handling, bench testing and implantations. This paper explores extensively new techniques including annealing, melting, anchoring, and XeF2 silicon surface roughening to enhance this adhesion. We report the first quantitative experimental data on the effectiveness of each through tearing, soaking, etching and ASTM peeling tests. The results show various improved adhesion means over the standard A-174 adhesion promotion, which can greatly benefit the use of parylene.
Keywords :
adhesion; annealing; biomedical materials; materials testing; melting; packaging; silicon; surface roughness; Si; XeF2; anchoring; annealing; biocompatible coating; etching; melting; parylene-C; peeling; silicon adhesion; soaking; surface roughening; tearing; temperature 200 degC; Adhesives; Annealing; Cleaning; Coatings; Probes; Rough surfaces; Silicon; Surface roughness; Surface treatment; Testing; Adhesion; CVD thin-film; Packaging; Parylene-C;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
Conference_Location :
Denver, CO
Print_ISBN :
978-1-4244-4190-7
Electronic_ISBN :
978-1-4244-4193-8
Type :
conf
DOI :
10.1109/SENSOR.2009.5285963
Filename :
5285963
Link To Document :
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