Analysis of heat and fluid flow in a PCB channel using KAICUBE/Hanbit-1 parallel computer

Author

Yun, B.T. ; Choi, D.H.

Author_Institution

Dept. of Mech. Eng., Korea Adv. Inst. of Sci. & Technol., Seoul, South Korea

fYear

1997

fDate

28 Apr-2 May 1997

Firstpage

89

Lastpage

92

Abstract

A 3D analysis code for mixed convection flow through the printed circuit board (PCB) channel on which heat-generating chip modules are mounted has been developed. For uniformly distributed modules, a small domain containing a single module is considered with periodic and symmetric boundary conditions. Calculations have been made for various Grashof numbers to examine the effects of natural convection for both adiabatic and conducting wall conditions. The program is designed to run on the KAICUBE/Hanbit-1 parallel computer, and its performance on different machines is compared in this paper

Keywords

channel flow; circuit analysis computing; convection; flow simulation; multichip modules; parallel programming; printed circuits; software performance evaluation; 3D analysis code; Grashof numbers; KAICUBE/Hanbit-1 parallel computer; PCB channel; adiabatic conditions; conducting wall conditions; fluid flow analysis; heat flow analysis; heat-generating chip modules; mixed convection flow; performance; periodic boundary conditions; printed circuit board; symmetric boundary conditions; uniformly distributed modules; Concurrent computing; DH-HEMTs; Equations; Fluid flow; Heat engines; Heat transfer; Mechanical engineering; Power system reliability; Printed circuits; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

High Performance Computing on the Information Superhighway, 1997. HPC Asia '97

Conference_Location

Seoul

Print_ISBN

0-8186-7901-8

Type

conf

DOI

10.1109/HPC.1997.592128

Filename

592128