Stress migration in a copper - Aluminum hybrid technology

Author

Christiansen, C. ; Chapple-Sokol, J. ; Coster, Michael ; Hunt, Daniel ; Lee, Tao C. ; Murphy, William ; Gambino, J. ; Cooney, Edward ; Kemerer, Timothy ; Rassel, Robert ; Stamper, Tony ; U´Ren, Gregory ; Lariviere, Stephane ; Brandon, Stephane

Author_Institution

IBM Syst. & Technol. Group, Essex Junction, VT, USA

fYear

2014

fDate

1-5 June 2014

Abstract

Stress migration (SM) time, temperature and process dependencies are investigated using a highly sensitive tungsten to copper interface combined with “plate-nose” and “mesh-nose” structures to accelerate the SM mechanism. Voids formed below the W via on the nose, and the resistance increases caused by these voids peaked at temperatures of 300-325°C. The effects of several copper line and tungsten via process steps are discussed. Process steps which modulated the Cu surface and Cu to via bottom interface had the largest effects.

Keywords

aluminium alloys; copper alloys; tungsten; voids (solid); Cu; Cu surface; CuAl; W; bottom interface; copper interface; copper line; copper-aluminum hybrid technology; mesh-nose structures; plate-nose structures; sensitive tungsten; stress migration; temperature 300 degC to 325 degC; voids; Adhesives; Copper; Nose; Resistance; Stress; Surface treatment; Temperature sensors; SIV; SM; aluminum; copper; stress induced voiding; stress migration;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability Physics Symposium, 2014 IEEE International

Conference_Location

Waikoloa, HI

Type

conf

DOI

10.1109/IRPS.2014.6860580

Filename

6860580