Title :
Stress migration in a copper - Aluminum hybrid technology
Author :
Christiansen, C. ; Chapple-Sokol, J. ; Coster, Michael ; Hunt, Daniel ; Lee, Tao C. ; Murphy, William ; Gambino, J. ; Cooney, Edward ; Kemerer, Timothy ; Rassel, Robert ; Stamper, Tony ; U´Ren, Gregory ; Lariviere, Stephane ; Brandon, Stephane
Author_Institution :
IBM Syst. & Technol. Group, Essex Junction, VT, USA
Abstract :
Stress migration (SM) time, temperature and process dependencies are investigated using a highly sensitive tungsten to copper interface combined with “plate-nose” and “mesh-nose” structures to accelerate the SM mechanism. Voids formed below the W via on the nose, and the resistance increases caused by these voids peaked at temperatures of 300-325°C. The effects of several copper line and tungsten via process steps are discussed. Process steps which modulated the Cu surface and Cu to via bottom interface had the largest effects.
Keywords :
aluminium alloys; copper alloys; tungsten; voids (solid); Cu; Cu surface; CuAl; W; bottom interface; copper interface; copper line; copper-aluminum hybrid technology; mesh-nose structures; plate-nose structures; sensitive tungsten; stress migration; temperature 300 degC to 325 degC; voids; Adhesives; Copper; Nose; Resistance; Stress; Surface treatment; Temperature sensors; SIV; SM; aluminum; copper; stress induced voiding; stress migration;
Conference_Titel :
Reliability Physics Symposium, 2014 IEEE International
Conference_Location :
Waikoloa, HI
DOI :
10.1109/IRPS.2014.6860580
