Title :
Lifetime prediction for stress-induced voiding in nose-shape lines by using a stress-diffusion analytical model
Author :
Yokogawa, Shinji
Author_Institution :
Production Manage. Dept., Polytech. Univ., Kodaira, Japan
Abstract :
A lifetime prediction model for stress-induced voiding (SIV) in Cu/low-κ interconnects has been proposed for nose-shape lines. The stress, baseline, and nose-shape line are related by the Gompertz function. Stress-induced Cu ionic diffusion is described by a differential equation, and the lifetime is a solution of that equation. Finally, the calculated lifetime values are compared to reported values.
Keywords :
differential equations; interconnections; low-k dielectric thin films; Cu; Gompertz function; SIV; baseline; differential equation; ionic diffusion; lifetime prediction model; low-κ interconnects; nose-shape lines; stress-diffusion analytical model; stress-induced voiding; Grain boundaries; Layout; Mathematical model; Predictive models; Reliability; Stress; lifetime prediction; nose-shape lines; stress-diffusion analytical model; stress-induced voiding;
Conference_Titel :
Reliability Physics Symposium, 2014 IEEE International
Conference_Location :
Waikoloa, HI
DOI :
10.1109/IRPS.2014.6860582
