DocumentCode :
1866662
Title :
Screen-printed reflector pastes for back passivated crystalline silicon solar cells
Author :
Merchant, Nirav ; Jiang, Hongbo ; Shaikh, Ali ; Graddy, E. ; Zhang, Dejing
Author_Institution :
ECGM, Ferro Corp., Vista, CA, USA
fYear :
2011
fDate :
19-24 June 2011
Abstract :
Solar cell manufacturers across the world are working to find innovative ways to reduce cost per installed watt of photovoltaic energy generation in order to achieve grid parity. Some of these approaches involve the use of revolutionary cell architectures such as metal wrap-through (MWT) [1], PERC cells, local back surface field (BSF) [2] and selective emitter among others. Many of these new approaches call for development of special back Al pastes that can either fire-through passivation stacks such as Al2O3/SiNx [3] or form local BSF in laser opened vias. In other designs, the Al paste needs to act as a reflective surface below the SiNx layer, without firing through the dielectric layer (reflector paste). In this paper we discuss the requirements for reflector paste in back-passivated cell applications. The paper will also present the various attributes of these pastes such as non firethrough properties, adhesion to SiO2, Al2O3 or SiNx passivation layers, excellent reflectance and low electrical resistance.
Keywords :
elemental semiconductors; firing (materials); passivation; photovoltaic power systems; power grids; printing; silicon; solar cells; MWT; PERC cell; Si; back passivated crystalline solar cell; cost reduction; dielectric layer; electrical resistance; fire-through passivation stack; grid parity; laser opened vias; local BSF; local back surface field; metal wrap-through; photovoltaic energy generation; reflective surface; revolutionary cell architecture; screen-printed reflector paste; selective emitter; solar cell manufacturer; Additives; Adhesives; Conductivity; Dielectrics; Passivation; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Photovoltaic Specialists Conference (PVSC), 2011 37th IEEE
Conference_Location :
Seattle, WA
ISSN :
0160-8371
Print_ISBN :
978-1-4244-9966-3
Type :
conf
DOI :
10.1109/PVSC.2011.6186389
Filename :
6186389
Link To Document :
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