Title :
From VLSI to WLSI an introduction to 3D wafer level system integration
Author :
Chih Hang Tung ; Yu, Doug
Author_Institution :
R&D, Taiwan Semicond. Manuf. Co., Hsinchu, Taiwan
fDate :
June 29 2015-July 2 2015
Abstract :
Wafer level system integration (WLSI) as the new system scaling technology platform is taking the stage in parallel to transistor level Moor´s Law scaling to drive the semiconductor industry moving forward in new mobile computing and Internet-of-Thing (IoT) markets. Two key WLSI technology platforms, Chip-on-Wafer-on-Substrate (CoWoS) and Integrated Fan-Out (InFO) are introduced and their merits are discussed. Both CoWoS and InFO are scalable and sustainable to continuously driving future semiconductor industry revolution.
Keywords :
VLSI; semiconductor technology; wafer level packaging; 3D wafer level system integration; Internet-of-Thing; VLSI; WLSI; chip-on-wafer-on-substrate; integrated fan-out; mobile computing; semiconductor industry; Electronics industry; Packaging; Speech; Three-dimensional displays; Transistors; Very large scale integration;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2015 IEEE 22nd International Symposium on the
Conference_Location :
Hsinchu
DOI :
10.1109/IPFA.2015.7224323
