• DocumentCode
    1867014
  • Title

    Quality and reliability investigation of Ni/Sn transient liquid phase bonding technology

  • Author

    Tsung-Yen Tsai ; Yao-Jen Chang ; Kuan-Neng Chen

  • Author_Institution
    Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
  • fYear
    2015
  • fDate
    June 29 2015-July 2 2015
  • Firstpage
    492
  • Lastpage
    495
  • Abstract
    A submicron of Ni/Sn transient liquid phase bonding at low temperature was investigated to surmount nowadays fine-pitch Cu/Sn process challenge. After bonding process, only uniform and high-temperature stable Ni3Sn4 intermetallic compound was existed. In addition, the advantages of this scheme showed excellent electrical and reliability performance and mechanical strength.
  • Keywords
    alloys; bonding processes; copper; fine-pitch technology; nickel; tin; Cu-Sn; Ni-Sn; Ni3Sn4; bonding process; fine-pitch process challenge; intermetallic compound; transient liquid phase bonding technology; Bonding; Contact resistance; Liquids; Nickel; Reliability; Tin; Transient analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits (IPFA), 2015 IEEE 22nd International Symposium on the
  • Conference_Location
    Hsinchu
  • Type

    conf

  • DOI
    10.1109/IPFA.2015.7224326
  • Filename
    7224326
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1867014