Characteristic improvement of inkjet printed Ag interconnects using tape on-off and mirror-reaction processes

In the paper, we develop and implement the processes of tape on-off and Ag mirror-reaction to the previously developed size scalable inkjet printing process technique, i.e. CPLoP (Combined Process of Lift-off and Printing) for continuing its future interconnect applications in flexible microelectronics. The newly developed processes not only reduce coffee ring effect but also improve better electrical conductivity of the printed Ag interconnects at low process temperature. A 10μm wide Ag interconnect with flat surface morphology and low electrical resistivity, i.e. 7.7 μΩ · cm, has been realized.