DocumentCode
1867159
Title
Cutting-edge technologies for failure analysis and their applications in industry
Author
Kuo, P.S. ; Liu, C.Y.
Author_Institution
Mater. Anal. Technol. Inc., Hsinchu, Taiwan
fYear
2015
fDate
June 29 2015-July 2 2015
Firstpage
52
Lastpage
55
Abstract
With the fast development of semiconductor fabrication, IC devices reduce their feature size and increase their complexity continuously. Failure analysis (FA) for such devices needs advanced and powerful tools. Here, we introduce two advanced FA technologies: Thermal emission microscopy (THEMOS) and 3D X-ray microscopy. Several industrial cases using these two technologies to identify failures were demonstrated.
Keywords
X-ray microscopy; failure analysis; integrated circuit manufacture; 3D X-ray microscopy; IC devices; THEMOS; failure analysis; feature size; semiconductor fabrication; thermal emission microscopy; Electronic components; Failure analysis; Image reconstruction; Microelectronics; Nondestructive testing; X-ray imaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits (IPFA), 2015 IEEE 22nd International Symposium on the
Conference_Location
Hsinchu
Type
conf
DOI
10.1109/IPFA.2015.7224331
Filename
7224331
Link To Document