Title :
Cutting-edge technologies for failure analysis and their applications in industry
Author :
Kuo, P.S. ; Liu, C.Y.
Author_Institution :
Mater. Anal. Technol. Inc., Hsinchu, Taiwan
fDate :
June 29 2015-July 2 2015
Abstract :
With the fast development of semiconductor fabrication, IC devices reduce their feature size and increase their complexity continuously. Failure analysis (FA) for such devices needs advanced and powerful tools. Here, we introduce two advanced FA technologies: Thermal emission microscopy (THEMOS) and 3D X-ray microscopy. Several industrial cases using these two technologies to identify failures were demonstrated.
Keywords :
X-ray microscopy; failure analysis; integrated circuit manufacture; 3D X-ray microscopy; IC devices; THEMOS; failure analysis; feature size; semiconductor fabrication; thermal emission microscopy; Electronic components; Failure analysis; Image reconstruction; Microelectronics; Nondestructive testing; X-ray imaging;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2015 IEEE 22nd International Symposium on the
Conference_Location :
Hsinchu
DOI :
10.1109/IPFA.2015.7224331
