• DocumentCode
    1867165
  • Title

    Non-destructive measurement of the degree of cross-linking of EVA solar module encapsulation

  • Author

    Lloyd, John ; Christian, Theresa ; Doble, Dan ; Mickiewicz, Rafal A.

  • Author_Institution
    Fraunhofer Center for Sustainable Energy Syst. (CSE), Cambridge, MA, USA
  • fYear
    2011
  • fDate
    19-24 June 2011
  • Abstract
    A novel technique was developed to correlate the degree of cross-linking in laminated ethylene vinyl acetate (EVA) solar encapsulation with the cured EVA viscoelastic response by means of a compressive stress relaxation measurement. The technique was demonstrated on mini-modules fabricated with two different commercially available EVA encapsulants and four different commercially available backsheets. The indentation test was found to be most sensitive at elevated temperature and it was possible to predict the gel content of low, medium, and high cross-linked samples to at least a 95% confidence level. Furthermore, the method was found to be nondestructive and can be applied to photovoltaic modules after lamination, enabling a rapid metrology technique for process and quality control in module manufacturing.
  • Keywords
    compressive strength; encapsulation; indentation; nondestructive testing; organic compounds; quality control; solar cells; EVA solar module encapsulation; compressive stress relaxation measurement; cross-linking; cured EVA viscoelastic response; gel content; indentation test; laminated ethylene vinyl acetate; nondestructive measurement; photovoltaic modules; quality control; rapid metrology; Force; Force measurement; Polymers; Solvents; Stress; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialists Conference (PVSC), 2011 37th IEEE
  • Conference_Location
    Seattle, WA
  • ISSN
    0160-8371
  • Print_ISBN
    978-1-4244-9966-3
  • Type

    conf

  • DOI
    10.1109/PVSC.2011.6186408
  • Filename
    6186408