DocumentCode
1867165
Title
Non-destructive measurement of the degree of cross-linking of EVA solar module encapsulation
Author
Lloyd, John ; Christian, Theresa ; Doble, Dan ; Mickiewicz, Rafal A.
Author_Institution
Fraunhofer Center for Sustainable Energy Syst. (CSE), Cambridge, MA, USA
fYear
2011
fDate
19-24 June 2011
Abstract
A novel technique was developed to correlate the degree of cross-linking in laminated ethylene vinyl acetate (EVA) solar encapsulation with the cured EVA viscoelastic response by means of a compressive stress relaxation measurement. The technique was demonstrated on mini-modules fabricated with two different commercially available EVA encapsulants and four different commercially available backsheets. The indentation test was found to be most sensitive at elevated temperature and it was possible to predict the gel content of low, medium, and high cross-linked samples to at least a 95% confidence level. Furthermore, the method was found to be nondestructive and can be applied to photovoltaic modules after lamination, enabling a rapid metrology technique for process and quality control in module manufacturing.
Keywords
compressive strength; encapsulation; indentation; nondestructive testing; organic compounds; quality control; solar cells; EVA solar module encapsulation; compressive stress relaxation measurement; cross-linking; cured EVA viscoelastic response; gel content; indentation test; laminated ethylene vinyl acetate; nondestructive measurement; photovoltaic modules; quality control; rapid metrology; Force; Force measurement; Polymers; Solvents; Stress; Temperature measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Photovoltaic Specialists Conference (PVSC), 2011 37th IEEE
Conference_Location
Seattle, WA
ISSN
0160-8371
Print_ISBN
978-1-4244-9966-3
Type
conf
DOI
10.1109/PVSC.2011.6186408
Filename
6186408
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