Application of FIB-SEM and Raman spectroscopy for investigating conductive carbon particles in epoxy encapsulation of IC

Author

Shih Chia Lai ; Sharma, Pradeep ; Otte, Rik ; Jung Hao Kung ; Yao-han Wang ; Chen, Sharon

Author_Institution

Regional Quality Centre-Kaohsiung, NXP Semicond. N.V., Taiwan

fYear

2015

fDate

June 29 2015-July 2 2015

Firstpage

56

Lastpage

60

Abstract

We report investigation about three types of conductive carbon particles viz. pure carbon particles, SiO₂ filler mixed carbon particles, and SiO₂@C core-shell particles in epoxy encapsulations of IC. SEM, EDX, FIB voltage contrast imaging, and Raman spectroscopy are used to characterize conductive carbon particles, and to identify their potential origin.

Keywords

Raman spectroscopy; carbon; encapsulation; focused ion beam technology; integrated circuit packaging; integrated circuit testing; scanning electron microscopy; EDX; FIB voltage contrast imaging; FIB-SEM; IC; Raman spectroscopy; SiO₂-C; conductive carbon particles; core-shell particles; epoxy encapsulation; focused ion beam; integrated circuit; scanning electron microscopy; Bonding; Carbon; Electromagnetic compatibility; Encapsulation; Integrated circuits; Scanning electron microscopy; Wires;

fLanguage

English

Publisher

ieee

Conference_Titel

Physical and Failure Analysis of Integrated Circuits (IPFA), 2015 IEEE 22nd International Symposium on the

Conference_Location

Hsinchu

Type

conf

DOI

10.1109/IPFA.2015.7224332

Filename

7224332