DocumentCode
186719
Title
CMOS image sensor: Process impact on dark current
Author
Carrere, J.-P. ; Place, S. ; Oddou, J.-P. ; Benoit, Daniel ; Roy, Francis
Author_Institution
FTM / Technol. R&D, STMicrolelectronics, Crolles, France
fYear
2014
fDate
1-5 June 2014
Abstract
Dark current is a major concern for the CMOS Image sensor. If the Shockley-Read-Hall generation creates this current, the origin of defects is multiple. Metallic contaminants cause deep level bulk defects, this gives the blemish pixels. The interface states generate the mean dark current of the pixel. The good use of Forming Gas anneal is needed to passivate these interfaces. Next, all the plasma processes have to be optimized not to dissociate the passivation, because of the deep UV and the electric field created by plasma. Finally, some process improvements, or the choice of a p-type pixel with holes collection, should give robust image sensors with low and controlled dark current.
Keywords
CMOS image sensors; annealing; passivation; plasma applications; CMOS image sensor; Shockley-Read-Hall generation; dark current; deep UV plasma; deep level bulk defect; electric field; forming gas annealling; metallic contaminant; p-type pixel; passivation; plasma processing; Annealing; Cavity resonators; Dark current; Dielectrics; Mathematical model; Plasmas; Silicon; Blemish pixel; CMOS Image sensor; Dark current; Deep UV; Holes collection pixel; Interface states engineering; P-type pixel; Plasma Induced Damage; SRH generation;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 2014 IEEE International
Conference_Location
Waikoloa, HI
Type
conf
DOI
10.1109/IRPS.2014.6860620
Filename
6860620
Link To Document