• DocumentCode
    186734
  • Title

    Reliability issues in GaN and SiC power devices

  • Author

    Ueda, Toshitsugu

  • Author_Institution
    Power Electron. Dev. Center, Panasonic Corp., Moriguchi, Japan
  • fYear
    2014
  • fDate
    1-5 June 2014
  • Abstract
    GaN and SiC have been widely investigated for future power switching systems with high efficiencies. So far, prototypes of working transistors using these wide bandgap materials have demonstrated the superior performances suggesting the great potential. Remaining tasks for the commercialization include finding niche applications as entry ones with the well-established reliability. In this paper, recent progress of the GaN and SiC power devices developed at Panasonic is reviewed. After reviewing the reliability issues in the conventional transistors, normally-off GaN Gate Injection Transistors (GITs) and SiC Diode-integrated MOSFET (DioMOS) free from the degradations are presented. These state-of-the-art GaN and SiC devices are very promising for practical applications.
  • Keywords
    III-V semiconductors; gallium compounds; power MOSFET; silicon compounds; wide band gap semiconductors; DioMOS; GIT; GaN; Panasonic; SiC; diode-integrated MOSFET; gate injection transistors; niche applications; power devices; power switching systems; reliability issues; wide bandgap materials; working transistors; Degradation; Gallium nitride; Logic gates; Reliability; Silicon carbide; Threshold voltage; Transistors; Current collapse; Diode-integrated MOS (DioMOS); Gallium Nitride (GaN); Gate Injection Transistor (GIT); Silicon Carbide (SiC);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 2014 IEEE International
  • Conference_Location
    Waikoloa, HI
  • Type

    conf

  • DOI
    10.1109/IRPS.2014.6860629
  • Filename
    6860629