DocumentCode
186734
Title
Reliability issues in GaN and SiC power devices
Author
Ueda, Toshitsugu
Author_Institution
Power Electron. Dev. Center, Panasonic Corp., Moriguchi, Japan
fYear
2014
fDate
1-5 June 2014
Abstract
GaN and SiC have been widely investigated for future power switching systems with high efficiencies. So far, prototypes of working transistors using these wide bandgap materials have demonstrated the superior performances suggesting the great potential. Remaining tasks for the commercialization include finding niche applications as entry ones with the well-established reliability. In this paper, recent progress of the GaN and SiC power devices developed at Panasonic is reviewed. After reviewing the reliability issues in the conventional transistors, normally-off GaN Gate Injection Transistors (GITs) and SiC Diode-integrated MOSFET (DioMOS) free from the degradations are presented. These state-of-the-art GaN and SiC devices are very promising for practical applications.
Keywords
III-V semiconductors; gallium compounds; power MOSFET; silicon compounds; wide band gap semiconductors; DioMOS; GIT; GaN; Panasonic; SiC; diode-integrated MOSFET; gate injection transistors; niche applications; power devices; power switching systems; reliability issues; wide bandgap materials; working transistors; Degradation; Gallium nitride; Logic gates; Reliability; Silicon carbide; Threshold voltage; Transistors; Current collapse; Diode-integrated MOS (DioMOS); Gallium Nitride (GaN); Gate Injection Transistor (GIT); Silicon Carbide (SiC);
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 2014 IEEE International
Conference_Location
Waikoloa, HI
Type
conf
DOI
10.1109/IRPS.2014.6860629
Filename
6860629
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