• DocumentCode
    1867512
  • Title

    UTB GeOI 6T SRAM cell and sense amplifier considering BTI reliability

  • Author

    Hu, Vita Pi-Ho ; Pin Su ; Ching-Te Chuang

  • Author_Institution
    Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
  • fYear
    2015
  • fDate
    June 29 2015-July 2 2015
  • Firstpage
    111
  • Lastpage
    114
  • Abstract
    This paper investigates the impacts of negative and positive bias temperature instabilities (NBTI and PBTI) on the stability of ultra-thin-body (UTB) GeOI 6T SRAM cell and performance of sense amplifier compared with the SOI counterparts. Worst case stress scenarios for read and write operations are analyzed. For UTB GeOI SRAMs, PBTI dominates the degradations in read static noise margin (RSNM), while for UTB SOI SRAMs, NBTI dominates the degradations in RSNM. Write static noise margin (WSNM) only slightly degrades due to NBTI and PBTI. Current latch sense amplifier (CLSA) and voltage latch sense amplifier (VLSA) are analyzed considering NBTI/PBTI for GeOI and SOI devices. GeOI CLSA and VLSA show smaller word-line to SAE buffer delay (TBL) and sense amplifier sensing delay (TSA) than the SOI counterparts. As aging time increases, GeOI CLSA and VLSA show larger degradations of TSA than the SOI counterparts.
  • Keywords
    SRAM chips; amplifiers; negative bias temperature instability; BTI reliability; NBTI; PBTI; UTB GeOI 6T SRAM cell; current latch sense amplifier; negative bias temperature instabilities; positive bias temperature instabilities; read static noise margin; ultra-thin-body; voltage latch sense amplifier; write static noise margin; Degradation; Delays; MOSFET; SRAM cells; Sensors; Stress; Wireless sensor networks;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits (IPFA), 2015 IEEE 22nd International Symposium on the
  • Conference_Location
    Hsinchu
  • Type

    conf

  • DOI
    10.1109/IPFA.2015.7224345
  • Filename
    7224345