DocumentCode
1867950
Title
Enhanced passivation integrity test for improved passivation failure detection
Author
Lee, S. ; Ang, P.C. ; Mo, Z.Q. ; Zhao, S.P. ; Lam, J.
Author_Institution
GLOBALFOUNDRIES (Singapore) Pte Ltd., Singapore, Singapore
fYear
2015
fDate
June 29 2015-July 2 2015
Firstpage
185
Lastpage
188
Abstract
The passivation or glassivation of a die seals the top metallization of a micro device from moisture and mobile contaminants. It also prevents the die from mechanical and chemical damage during final assembly. Because of its importance, the passivation should be care fully assessed for thickness, cove rage and integrity. A passivation integrity test is usually performed to check the structural quality of the passivation film on new process developed devices. However, as the complexity of top metallization increases/becomes denser and as metallization dimension shrinks, detection of passivation defect (e.g. pinhole, cracks, etc.) would be a challenge using the standard passivation integrity test. Hence, by enhancing the standard passivation integrity test procedure, the detection of passivation flaws can be easily eased.
Keywords
failure analysis; metallisation; passivation; enhanced passivation integrity test; improved passivation failure detection; passivation film; top metallization; Inspection; Metals; Microscopy; Optical imaging; Optical microscopy; Passivation; Standards;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits (IPFA), 2015 IEEE 22nd International Symposium on the
Conference_Location
Hsinchu
Type
conf
DOI
10.1109/IPFA.2015.7224363
Filename
7224363
Link To Document