DocumentCode :
1868210
Title :
The investigation of Active VC and EBAC analysis utilization on test structure
Author :
Link Chang ; Kuo Yu Wang ; Wang, Simon T. C. ; Yu Pang Chang
Author_Institution :
United Microelectron. Corp., Ltd., Tainan, Taiwan
fYear :
2015
fDate :
June 29 2015-July 2 2015
Firstpage :
205
Lastpage :
208
Abstract :
As the founded of nano-probing technique on Scanning Electron Microscope (SEM) base system, the Active Voltage Contrast (AVC) and electron beam absorbed current (EBAC) technique are easier to apply on failure analysis. Both these two can isolate failure location accurately, and high resistance site also can be located by these powerful tools. Based on passed analysis experience, we will investigate and present the utilization of these two techniques to develop the better condition. By the investigating on test circuit of metal/via chain, the better effective analysis skill can be applied to the related high resistance failure analysis.
Keywords :
failure analysis; integrated circuit reliability; integrated circuit testing; scanning electron microscopy; EBAC analysis utilization; active voltage contrast; electron beam absorbed current technique; high resistance failure analysis; metal-via chain; nanoprobing technique; scanning electron microscope; test structure; Automatic voltage control; Electron beams; Failure analysis; Metals; Probes; Resistance; Scanning electron microscopy;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2015 IEEE 22nd International Symposium on the
Conference_Location :
Hsinchu
Type :
conf
DOI :
10.1109/IPFA.2015.7224372
Filename :
7224372
Link To Document :
بازگشت