The investigation of Active VC and EBAC analysis utilization on test structure

Author

Link Chang ; Kuo Yu Wang ; Wang, Simon T. C. ; Yu Pang Chang

Author_Institution

United Microelectron. Corp., Ltd., Tainan, Taiwan

fYear

2015

fDate

June 29 2015-July 2 2015

Firstpage

205

Lastpage

208

Abstract

As the founded of nano-probing technique on Scanning Electron Microscope (SEM) base system, the Active Voltage Contrast (AVC) and electron beam absorbed current (EBAC) technique are easier to apply on failure analysis. Both these two can isolate failure location accurately, and high resistance site also can be located by these powerful tools. Based on passed analysis experience, we will investigate and present the utilization of these two techniques to develop the better condition. By the investigating on test circuit of metal/via chain, the better effective analysis skill can be applied to the related high resistance failure analysis.

Keywords

failure analysis; integrated circuit reliability; integrated circuit testing; scanning electron microscopy; EBAC analysis utilization; active voltage contrast; electron beam absorbed current technique; high resistance failure analysis; metal-via chain; nanoprobing technique; scanning electron microscope; test structure; Automatic voltage control; Electron beams; Failure analysis; Metals; Probes; Resistance; Scanning electron microscopy;

fLanguage

English

Publisher

ieee

Conference_Titel

Physical and Failure Analysis of Integrated Circuits (IPFA), 2015 IEEE 22nd International Symposium on the

Conference_Location

Hsinchu

Type

conf

DOI

10.1109/IPFA.2015.7224372

Filename

7224372