• DocumentCode
    1868344
  • Title

    Study of de-golding technology for MIM capacitor failure analysis in GaAs integrated circuit

  • Author

    Liyuan Liu ; Xuanlong Chen ; Zeya Peng

  • Author_Institution
    China CEPREI Lab., Reliability Res. & Anal. Center, Guangzhou, China
  • fYear
    2015
  • fDate
    June 29 2015-July 2 2015
  • Firstpage
    231
  • Lastpage
    233
  • Abstract
    In older to show the failure phenomena of breakdown spot caused by a small energy voltage for metal-insulator-metal (MIM) capacitors failure analysis in GaAs integrated circuit, different methods of de-golding technology was discussed in this paper. A kind of de-golding solution was optimization with consideration of MIM capacitors´ construction and material. Typical MIM capacitor failure analysis cases that used the solution were introduced. The method of de-golding technology also can be applied to other metal-insulator-semiconductor (MIS) capacitors or MIM/MIS structures for failure analysis.
  • Keywords
    III-V semiconductors; MIM devices; MIS capacitors; gallium arsenide; integrated circuit reliability; integrated circuit testing; GaAs; MIM capacitor failure analysis; MIM-MIS structures; MIS capacitors; degolding technology; failure phenomena; integrated circuit; metal-insulator-metal capacitors; metal-insulator-semiconductor capacitors; Capacitors; Electric breakdown; Failure analysis; Gallium arsenide; Gold; Integrated circuits; MIM capacitors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits (IPFA), 2015 IEEE 22nd International Symposium on the
  • Conference_Location
    Hsinchu
  • Type

    conf

  • DOI
    10.1109/IPFA.2015.7224378
  • Filename
    7224378