DocumentCode
1868344
Title
Study of de-golding technology for MIM capacitor failure analysis in GaAs integrated circuit
Author
Liyuan Liu ; Xuanlong Chen ; Zeya Peng
Author_Institution
China CEPREI Lab., Reliability Res. & Anal. Center, Guangzhou, China
fYear
2015
fDate
June 29 2015-July 2 2015
Firstpage
231
Lastpage
233
Abstract
In older to show the failure phenomena of breakdown spot caused by a small energy voltage for metal-insulator-metal (MIM) capacitors failure analysis in GaAs integrated circuit, different methods of de-golding technology was discussed in this paper. A kind of de-golding solution was optimization with consideration of MIM capacitors´ construction and material. Typical MIM capacitor failure analysis cases that used the solution were introduced. The method of de-golding technology also can be applied to other metal-insulator-semiconductor (MIS) capacitors or MIM/MIS structures for failure analysis.
Keywords
III-V semiconductors; MIM devices; MIS capacitors; gallium arsenide; integrated circuit reliability; integrated circuit testing; GaAs; MIM capacitor failure analysis; MIM-MIS structures; MIS capacitors; degolding technology; failure phenomena; integrated circuit; metal-insulator-metal capacitors; metal-insulator-semiconductor capacitors; Capacitors; Electric breakdown; Failure analysis; Gallium arsenide; Gold; Integrated circuits; MIM capacitors;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits (IPFA), 2015 IEEE 22nd International Symposium on the
Conference_Location
Hsinchu
Type
conf
DOI
10.1109/IPFA.2015.7224378
Filename
7224378
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