DocumentCode
1868423
Title
Surface modification of polycrystalline Cu(In, Ga)Se2 thin-film solar cell absorber surfaces for PEEM measurements
Author
Wilks, R.G. ; Contreras, M.A. ; Lehmann, S. ; Herrero-Albillos, J. ; Bismaths, L. Tati ; Kronast, F. ; Noufi, R. ; Bär, M.
Author_Institution
Solar Energy Res., Helmholtz-Zentrum Berlin fur Mater. und Energie GmbH, Berlin, Germany
fYear
2011
fDate
19-24 June 2011
Abstract
We present a thorough examination of the μm-scale topography of Cu(In, Ga)Se2 (“CIGSe”) thin-film solar cell absorbers using different microscopy techniques. We specifically focus on the efficacy of preparing smooth sample surfaces - by etching in aqueous bromine solution - for a spatially resolved study of their chemical and electronic structures using photoelectron emission microscopy (PEEM). The etching procedure is shown to reduce the CIGSe surface roughness from ca. 40 to 25 nm after 40s etching, resulting in an increase in the quality of the obtained PEEM images. Furthermore we find that the average observed grain size at the etched surfaces appears larger than at the unetched surfaces. Using a liftoff procedure, it is additionally shown that the backside of the absorber is flat but finely patterned, likely due to being grown on the finely-structured Mo back contact.
Keywords
copper compounds; etching; gallium compounds; indium compounds; photoelectron microscopy; solar absorber-convertors; solar cells; surface roughness; ternary semiconductors; thin film devices; Cu(InGa)Se2; PEEM imaging; PEEM measurement; aqueous bromine solution etching; finely-structured back contact; lift-off procedure; photoelectron emission microscopy measurement; polycrystalline thin-film solar cell absorber surface; smooth sample surface preparation; surface etching; surface modification; surface roughness; time 40 s; Etching; Rough surfaces; Scanning electron microscopy; Surface morphology; Surface roughness; Surface topography;
fLanguage
English
Publisher
ieee
Conference_Titel
Photovoltaic Specialists Conference (PVSC), 2011 37th IEEE
Conference_Location
Seattle, WA
ISSN
0160-8371
Print_ISBN
978-1-4244-9966-3
Type
conf
DOI
10.1109/PVSC.2011.6186457
Filename
6186457
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