A new localized ink coating methodology for preventing photoresist deformation for TEM sample preparation

Author

Seah, S.S. ; Tee, I. ; Liu, B.H. ; Er, E. ; Zhao, S.P. ; Lam, J.

Author_Institution

GLOBALFOUNDRIES (Singapore) Pte Ltd., Singapore, Singapore

fYear

2015

fDate

June 29 2015-July 2 2015

Firstpage

263

Lastpage

266

Abstract

In this work we reported a new methodology for ink coating for TEM sample preparation. Detailed pre-FIB and FIB processes were performed under different conditions such as method of coating used and baking temperatures. TEM profile was taken on all prepared sample to understand the critical dimensions of PR under various conditions, and a comparison was made to conclude the best coating method to minimize PR profile deformation during sample preparation. Finally, a new technique of using static glass needle to apply ink coating was introduced to enhance coating application on very localized site specific structures.

Keywords

coating techniques; deformation; focused ion beam technology; glass; ink; photoresists; transmission electron microscopy; PR profile deformation; TEM profile; TEM sample preparation; baking temperatures; critical dimensions; ink coating; photoresist deformation; pre-FIB processes; static glass needle; very localized site specific structures; Coatings; Failure analysis; Heating; Ink; Needles; Scanning electron microscopy; Surface treatment; E-beam deformation; FIB; Low-dose; Photo-resist; TEM; failure analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Physical and Failure Analysis of Integrated Circuits (IPFA), 2015 IEEE 22nd International Symposium on the

Conference_Location

Hsinchu

Type

conf

DOI

10.1109/IPFA.2015.7224393

Filename

7224393