• DocumentCode
    1868798
  • Title

    Application of voltage and waveform forcing method for electrical isolation of complex and loop circuit in failure analysis

  • Author

    Li Tian ; Kuibo Lan ; Gaojie Wen ; Xiaocui Li ; Dong Wang

  • Author_Institution
    Product Anal. Lab. of Quality Dept., Freescale Semicond. (China) Ltd., Tianjin, China
  • fYear
    2015
  • fDate
    June 29 2015-July 2 2015
  • Firstpage
    279
  • Lastpage
    282
  • Abstract
    With multi-metal layers and scaling down we occurred many difficulties in FA. Due to coverage of metal layers precise emission spots and hotspots were not captured and sometimes many test points were planted Pt probe pad to perform failure isolation difficultly. So, some new technologies for FA were developed in recent years, for example NAIL, and laser voltage probing and so on. In this paper, we propose a method for complex and loop circuit in electrical failure isolation. The main ideas of forcing method were the simulation experiment on reference and fail parts for complex or loop circuit. Voltage and waveform were forced on some test points and the other signal was monitored. According to measured result, we could conclude the root cause was isolated on which signal. We shared three real successful cases with applying forcing method. So, we believed the advantages of forcing method were novel, effective and low cost. It was beneficial to our FA for complex and loop circuit in electrical failure isolation.
  • Keywords
    electrical faults; failure analysis; fault location; integrated circuit reliability; integrated circuit testing; complex circuit; electrical failure isolation; electrical isolation; failure analysis; loop circuit; multimetal layers; voltage method; waveform forcing method; Failure analysis; Integrated circuit modeling; Metals; Monitoring; Physics; Semiconductor device measurement; Voltage measurement; Failure analysis; complex and loop circuit; voltage and waveform forcing method;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits (IPFA), 2015 IEEE 22nd International Symposium on the
  • Conference_Location
    Hsinchu
  • Type

    conf

  • DOI
    10.1109/IPFA.2015.7224397
  • Filename
    7224397