• DocumentCode
    1868842
  • Title

    Study on salicide partial missing induce advanced SRAM device soft failure

  • Author

    Shouzhu Guo ; Sun, Tommy ; Xu, Pierce ; MingJie Xu

  • Author_Institution
    Semicond. Manuf. Int. Corp. (SMIC), Shanghai, China
  • fYear
    2015
  • fDate
    June 29 2015-July 2 2015
  • Firstpage
    283
  • Lastpage
    286
  • Abstract
    In our case, the chips passed the Memory of Built-in Self Test (MBIST) test under low voltage, but failed the MBIST test under higher voltage. Shmoo plots illustrate the MBIST failure is soft failure and claim the narrower window than the passed chips at high voltage side. Nanoprobing exhibits NMOS contact (CT) high resistance. Physical Failure Analysis (PFA) shows partial missing of salicide happens underneath of NMOS CT. Simulation results indicate that higher voltage or CT resistor causes lower noise margin for SRAM operation. Additional high voltage of MBIST test is proved as the optimal method to screen weak IC suffering partial salicide missing.
  • Keywords
    MOS memory circuits; SRAM chips; contact resistance; failure analysis; integrated circuit testing; logic testing; CT high resistance; CT resistor; MBIST failure; NMOS contact; PFA; SRAM device soft failure; memory of built-in self test; nanoprobing; physical failure analysis; salicide partial missing; Failure analysis; MOS devices; Noise; Random access memory; Resistance; Resistors; Simulation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits (IPFA), 2015 IEEE 22nd International Symposium on the
  • Conference_Location
    Hsinchu
  • Type

    conf

  • DOI
    10.1109/IPFA.2015.7224398
  • Filename
    7224398