DocumentCode
1868842
Title
Study on salicide partial missing induce advanced SRAM device soft failure
Author
Shouzhu Guo ; Sun, Tommy ; Xu, Pierce ; MingJie Xu
Author_Institution
Semicond. Manuf. Int. Corp. (SMIC), Shanghai, China
fYear
2015
fDate
June 29 2015-July 2 2015
Firstpage
283
Lastpage
286
Abstract
In our case, the chips passed the Memory of Built-in Self Test (MBIST) test under low voltage, but failed the MBIST test under higher voltage. Shmoo plots illustrate the MBIST failure is soft failure and claim the narrower window than the passed chips at high voltage side. Nanoprobing exhibits NMOS contact (CT) high resistance. Physical Failure Analysis (PFA) shows partial missing of salicide happens underneath of NMOS CT. Simulation results indicate that higher voltage or CT resistor causes lower noise margin for SRAM operation. Additional high voltage of MBIST test is proved as the optimal method to screen weak IC suffering partial salicide missing.
Keywords
MOS memory circuits; SRAM chips; contact resistance; failure analysis; integrated circuit testing; logic testing; CT high resistance; CT resistor; MBIST failure; NMOS contact; PFA; SRAM device soft failure; memory of built-in self test; nanoprobing; physical failure analysis; salicide partial missing; Failure analysis; MOS devices; Noise; Random access memory; Resistance; Resistors; Simulation;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits (IPFA), 2015 IEEE 22nd International Symposium on the
Conference_Location
Hsinchu
Type
conf
DOI
10.1109/IPFA.2015.7224398
Filename
7224398
Link To Document