Title :
A complete single-chip GPS receiver with 1.6-V 24-mW radio in 0.18-/spl mu/m CMOS
Author :
Kadoyama, T. ; Suzuki, N. ; Sasho, N. ; Iizuka, H. ; Nagase, I. ; Usukubo, H. ; Katakura, M.
Author_Institution :
Sony Corp. Semicond. Network Co., Kanagawa, Japan
Abstract :
We have developed a complete single-chip GPS receiver using 0.18-/spl mu/m CMOS to meet several important requirements, such as small size, low power, low cost and high sensitivity for mobile GPS applications. This is the first case in which a radio has been successfully combined with a baseband processor, such as SoC., in a GPS receiver. The GPS chip, with a total size of 6.4/spl times/6.4 mm, contains a 2.3/spl times/2.0 mm radio part, including RF front end, PLLs, IF functions, and 500 K gates of baseband logic, including mask ROM, SRAM and Dual Port SRAM. It´s fabricated using 0.18-/spl mu/m CMOS Technology with a MIM option and operates from a 1.6 to 2.0-V power supply. Experimental results show a very low power consumption of, typically, 57-mW for a fully functional chip including baseband, and a high sensitivity of -150 dBm. Through countermeasures for substrate coupling noise from the digital part, the high sensitivity was successfully achieved without any external LNA.
Keywords :
CMOS integrated circuits; Global Positioning System; SRAM chips; band-pass filters; integrated circuit noise; masks; mixers (circuits); phase locked loops; power consumption; radio receivers; read-only storage; system-on-chip; 0.18 micron; 1.6 to 2.0 V; 2.0 to 2.3 mm; 24 mW; 57 mW; 6.4 mm; CMOS technology; IF functions; MIM option; PLL; RF front end; SRAM; SoC; baseband logic processor; dual port SRAM; fully functional chip; low power consumption; mask ROM; mobile GPS applications; radio part; sensitivity; single-chip GPS receiver; substrate coupling noise; Baseband; CMOS logic circuits; CMOS technology; Costs; Global Positioning System; Logic gates; Radio frequency; Random access memory; Read only memory; Receivers;
Conference_Titel :
VLSI Circuits, 2003. Digest of Technical Papers. 2003 Symposium on
Conference_Location :
Kyoto, Japan
Print_ISBN :
4-89114-034-8
DOI :
10.1109/VLSIC.2003.1221182