DocumentCode :
1869143
Title :
Bump resistance change behavior due to Cu-Sn IMCs formation with various solder diameters
Author :
Wan-Lin Hsieh ; Chung-Kuang Lin ; Chau-Jie Zhan ; Yu-wei Huang ; Chih Chen
Author_Institution :
Dept. of Mater. Sci. & Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
fYear :
2015
fDate :
June 29 2015-July 2 2015
Firstpage :
362
Lastpage :
365
Abstract :
Theoretical calculation and simulation of FEM were proposed to explain the decline of change in resistance in Cu-Sn microbumps during the electromigration test. The IMC transformation from Cu6Sn5 to Cu3Sn was supposed to be the reason. Being aware that the dimension keeps shrinking, the behavior for various solder diameters was also investigated.
Keywords :
copper alloys; electromigration; solders; tin alloys; Cu3Sn; IMC; bump resistance change behavior; electromigration test; microbumps; solder diameters; Decision support systems; Electromigration; Finite element analysis; Resistance; Tin;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2015 IEEE 22nd International Symposium on the
Conference_Location :
Hsinchu
Type :
conf
DOI :
10.1109/IPFA.2015.7224407
Filename :
7224407
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1869143
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