DocumentCode
1869311
Title
InGaAs metal-oxide-semiconductor FETs with self-aligned Ni-Alloy source/drain
Author
Shin-Yuan Wang ; Chao-Hsin Chien ; Jin-Ju Lin ; Chun-Yen Chang
Author_Institution
Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
fYear
2015
fDate
June 29 2015-July 2 2015
Firstpage
415
Lastpage
418
Abstract
N-type InGaAs MOSFETs with self-aligned nickel-InGaAs alloy and ex-situ ALD Al2O3 as gate dielectrics was successfully fabricated. The InGaAs MOSFETs exhibit an S/D resistance (RSD) that is lower than that in P-N junction devices due to the low Schottky barrier height and the peak mobility was about 1138 cm2/V-s and the interface state density (Dit) was about 1012 cm-2eV-1 at ET = EV + 0.6 eV by using full-conductance method.
Keywords
III-V semiconductors; MOSFET; Schottky barriers; gallium arsenide; indium alloys; nickel alloys; InGaAs; MOSFET; full-conductance method; gate dielectrics; interface state density; low Schottky barrier height; metal-oxide-semiconductor FET; peak mobility; self-aligned source/drain; Aluminum oxide; Dielectrics; Indium gallium arsenide; Logic gates; MOSFET;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits (IPFA), 2015 IEEE 22nd International Symposium on the
Conference_Location
Hsinchu
Type
conf
DOI
10.1109/IPFA.2015.7224414
Filename
7224414
Link To Document