DocumentCode
1869605
Title
Fault isolation and TEM study in the state-of-art Thin-Film Transistor
Author
Yongkai Zhou ; Shik Lin Lee ; Chao Fu ; Younan Hua ; Xiaomin Li
Author_Institution
WinTech Nano-Technol. Services Pte. Ltd., Singapore, Singapore
fYear
2015
fDate
June 29 2015-July 2 2015
Firstpage
395
Lastpage
398
Abstract
In this work, we discussed the fault isolation method for Thin-Film Transistor (TFT). Many defects in TFT can be directly observed by optical microscope; however, for some defects, they are not visible in either optical microscope or SEM, which makes the fault isolation very challenging. We demonstrated that OBIRCH can be used to find the defect location in the leakage/short type TFT failure. The TFT is so fragile that the laser power and biasing voltage have to be very carefully controlled to avoid damaging the TFT. After identifying the defect location by OBIRCH hot spot, the following TEM analysis has successfully captured the defect.
Keywords
failure analysis; fault location; inspection; semiconductor device reliability; semiconductor device testing; thin film transistors; transmission electron microscopy; OBIRCH; TEM; defect location; fault isolation method; leakage type TFT failure; short type TFT failure; thin film transistor; transmission electron microscopy; Circuit faults; Indium tin oxide; Optical microscopy; Scanning electron microscopy; Silicon; Thin film transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits (IPFA), 2015 IEEE 22nd International Symposium on the
Conference_Location
Hsinchu
Type
conf
DOI
10.1109/IPFA.2015.7224425
Filename
7224425
Link To Document