• DocumentCode
    1869605
  • Title

    Fault isolation and TEM study in the state-of-art Thin-Film Transistor

  • Author

    Yongkai Zhou ; Shik Lin Lee ; Chao Fu ; Younan Hua ; Xiaomin Li

  • Author_Institution
    WinTech Nano-Technol. Services Pte. Ltd., Singapore, Singapore
  • fYear
    2015
  • fDate
    June 29 2015-July 2 2015
  • Firstpage
    395
  • Lastpage
    398
  • Abstract
    In this work, we discussed the fault isolation method for Thin-Film Transistor (TFT). Many defects in TFT can be directly observed by optical microscope; however, for some defects, they are not visible in either optical microscope or SEM, which makes the fault isolation very challenging. We demonstrated that OBIRCH can be used to find the defect location in the leakage/short type TFT failure. The TFT is so fragile that the laser power and biasing voltage have to be very carefully controlled to avoid damaging the TFT. After identifying the defect location by OBIRCH hot spot, the following TEM analysis has successfully captured the defect.
  • Keywords
    failure analysis; fault location; inspection; semiconductor device reliability; semiconductor device testing; thin film transistors; transmission electron microscopy; OBIRCH; TEM; defect location; fault isolation method; leakage type TFT failure; short type TFT failure; thin film transistor; transmission electron microscopy; Circuit faults; Indium tin oxide; Optical microscopy; Scanning electron microscopy; Silicon; Thin film transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits (IPFA), 2015 IEEE 22nd International Symposium on the
  • Conference_Location
    Hsinchu
  • Type

    conf

  • DOI
    10.1109/IPFA.2015.7224425
  • Filename
    7224425