DocumentCode
1869704
Title
A study of contact resistance model for the busbar joints lubricated by contact aid compounds
Author
Zhang, G.S. ; Lin, J. ; Chen, W.
Author_Institution
Fuzhou Univ., China
fYear
1998
fDate
26-28 Oct. 1998
Firstpage
172
Lastpage
178
Abstract
Based on previous studies about the contact resistance model and the conductive paste, the contact resistance model for the busbar joints lubricated by contact aid compounds is formed. The relation between the contact aid compound´s technical parameters and the contact spot´s microscopic parameters is established. Using this model, the numerical calculation and analysis of the contact spot´s microscopic parameters and the electrical contact properties are made, and some results are obtained. The computer simulation of the electrical contact phenomena is realized initially under lubricated and un-lubricated case.
Keywords
busbars; contact resistance; electrical contacts; lubrication; busbar joints; contact aid compounds; contact resistance model; contact spot; electrical contact phenomena; lubrication; microscopic parameters; Computational modeling; Computer simulation; Contact resistance; Elasticity; Mathematical model; Microscopy; Numerical models; Numerical simulation; Spline; Surface resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Contacts, 1998. Proceedings of the Forty-Fourth IEEE Holm Conference on
Conference_Location
Arlington, VA, USA
Print_ISBN
0-7803-4925-3
Type
conf
DOI
10.1109/HOLM.1998.722443
Filename
722443
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