• DocumentCode
    1869704
  • Title

    A study of contact resistance model for the busbar joints lubricated by contact aid compounds

  • Author

    Zhang, G.S. ; Lin, J. ; Chen, W.

  • Author_Institution
    Fuzhou Univ., China
  • fYear
    1998
  • fDate
    26-28 Oct. 1998
  • Firstpage
    172
  • Lastpage
    178
  • Abstract
    Based on previous studies about the contact resistance model and the conductive paste, the contact resistance model for the busbar joints lubricated by contact aid compounds is formed. The relation between the contact aid compound´s technical parameters and the contact spot´s microscopic parameters is established. Using this model, the numerical calculation and analysis of the contact spot´s microscopic parameters and the electrical contact properties are made, and some results are obtained. The computer simulation of the electrical contact phenomena is realized initially under lubricated and un-lubricated case.
  • Keywords
    busbars; contact resistance; electrical contacts; lubrication; busbar joints; contact aid compounds; contact resistance model; contact spot; electrical contact phenomena; lubrication; microscopic parameters; Computational modeling; Computer simulation; Contact resistance; Elasticity; Mathematical model; Microscopy; Numerical models; Numerical simulation; Spline; Surface resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Contacts, 1998. Proceedings of the Forty-Fourth IEEE Holm Conference on
  • Conference_Location
    Arlington, VA, USA
  • Print_ISBN
    0-7803-4925-3
  • Type

    conf

  • DOI
    10.1109/HOLM.1998.722443
  • Filename
    722443