Title :
Micromechanical robustness tests of 28nm BEOL layer stacks
Author :
Langer, Eckhard ; Geisler, Holm
Author_Institution :
GLOBALFOUNDRIES LLC & Co. KG, Dresden, Germany
fDate :
June 29 2015-July 2 2015
Abstract :
The paper describes two micromechanical stress tests, which evaluate the robustness of Back End Of Line (BEOL) layer stacks under mechanical stress, by applying bending stress to FIB prepared pillars and by using nanoindentation in previously prepared cross sections. Conclusions about mechanical robustness of BEOL integration schemes and particular design features are drawn.
Keywords :
bending strength; focused ion beam technology; materials testing; nanoindentation; BEOL layer stacks; FIB prepared pillars; back end of line layer stacks; bending stress; micromechanical robustness test; micromechanical stress test; nanoindentation; size 28 nm; Adhesives; Integrated circuit interconnections; Metallization; Robustness; Silicon; Stress;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2015 IEEE 22nd International Symposium on the
Conference_Location :
Hsinchu
DOI :
10.1109/IPFA.2015.7224439
