Title :
Acid decapsulation for silver wire bonded package
Author :
Suzuki, Satoshi ; Yamaguchi, Mamiko
Author_Institution :
Nippon Sci. Co., Ltd., Tokyo, Japan
fDate :
June 29 2015-July 2 2015
Abstract :
“Saturation Etching” is the method we have developed for decapsulating silver wire packages using a chemical solution. This method is also effective for copper wire packages, and damages to wires can be minimized by dissolving copper into acid.
Keywords :
copper; etching; integrated circuit packaging; lead bonding; silver; acid decapsulation; chemical solution; copper wire package; saturation etching; silver wire bonded package; Chemicals; Copper; Etching; Silver; Temperature measurement; Weight measurement; Wires;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2015 IEEE 22nd International Symposium on the
Conference_Location :
Hsinchu
DOI :
10.1109/IPFA.2015.7224440
