Title :
3D printed RF passive components by liquid metal filling
Author :
Chen Yang ; Sung-Yueh Wu ; Glick, Casey ; Yun Seok Choi ; Wensyang Hsu ; Liwei Lin
Author_Institution :
Univ. of California, Berkeley, Berkeley, CA, USA
Abstract :
We present three-dimensional (3D) micro-scale electrical components and systems by means of 3D printing and a liquid-metal-filling technique. The 3D supporting polymer structures with hollow channels and cavities are fabricated from inkjet printing. Liquid metals made of silver particles suspension in this demonstration are then injected into the hollow paths and solidified to form metallic elements and interconnects with high electrical conductivity. In the proof-of-concept demonstrations, various radio-frequency (RF) passive components, including 3D-shaped inductors, capacitors and resistors are fabricated and characterized. High-Q inductors and capacitors up to 1 GHz have been demonstrated. This work establishes an innovative way to construct arbitrary 3D electrical systems with efficient and labor-saving processes.
Keywords :
electrical conductivity; ink jet printing; liquid metals; microfabrication; micromechanical devices; passive networks; polymers; three-dimensional printing; 3D electrical systems; 3D printed RF passive components; 3D supporting polymer structures; 3D-shaped inductors; capacitors; cavities; high electrical conductivity; high-Q inductors; hollow channels; hollow paths; ink jet printing; liquid-metal-filling technique; metallic elements; radiofrequency passive components; resistors; silver particle suspension; three-dimensional microscale electrical components; Capacitors; Inductors; Liquids; Metals; Printing; Radio frequency; Three-dimensional displays;
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2015 28th IEEE International Conference on
Conference_Location :
Estoril
DOI :
10.1109/MEMSYS.2015.7050938
