Title :
Copper dendrite formation on laser fuse structures of flip chip die
Author :
Kho, W.F. ; Chan, Gary H. G.
Author_Institution :
Freescale Semicond. Malaysia, Petaling Jaya, Malaysia
fDate :
June 29 2015-July 2 2015
Abstract :
Copper dendrites on a flip chip die was analysed by SEM/EDX, FIB and TEM. The dendrites were found to consist of two layers. The upper layer visible under optical and SEM inspection consist of a carbon rich copper compound. TEM analysis revealed another layer under this carbon rich layer that consist of copper, tin and lead compounds. A possible mechanism of dendrite formation due to an electrochemical cell consisting of C4 bumps, copper at laser fuse structures and a moisture or flux electrolyte is proposed.
Keywords :
X-ray chemical analysis; dendrites; flip-chip devices; laser materials processing; scanning electron microscopy; transmission electron microscopy; C4 bumps; EDX; FIB; SEM; TEM; carbon rich layer; copper compound; copper dendrite formation; electrochemical cell; flip chip die; flux electrolyte; laser fuse structure; lead compound; tin compound; Carbon; Copper; Flip-chip devices; Fuses; Lead; Moisture; Tin;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2015 IEEE 22nd International Symposium on the
Conference_Location :
Hsinchu
DOI :
10.1109/IPFA.2015.7224459
