DocumentCode
1870615
Title
Active Electrostatic Force Microscopy
Author
Ippolito, Stephen ; Zumwalt, Sean ; Erickson, Andy
Author_Institution
Multiprobe Inc., Santa Barbara, CA, USA
fYear
2015
fDate
June 29 2015-July 2 2015
Firstpage
569
Lastpage
571
Abstract
We present Active Electrostatic Force Microscopy, as a new integrated circuit analysis technique for tracing nets and localizing opens. We demonstrate non-destructive surface and subsurface potential mapping, similar to Electron Beam Absorbed Current microscopy, without the associated high energy electron beam damage to the dielectrics.
Keywords
atomic force microscopy; integrated circuit testing; nondestructive testing; active electrostatic force microscopy; dielectrics; electron beam absorbed current microscopy; high energy electron beam damage; integrated circuit analysis technique; nondestructive surface potential mapping; subsurface potential mapping;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits (IPFA), 2015 IEEE 22nd International Symposium on the
Conference_Location
Hsinchu
Type
conf
DOI
10.1109/IPFA.2015.7224460
Filename
7224460
Link To Document