DocumentCode
1871153
Title
Known-good-die technologies on the horizon
Author
Vasquez, Barbara ; Van Overloop, D. ; Lindsey, Scott
Author_Institution
Semiconductor Products Sector, Motorola Inc., Tempe, AZ, USA
fYear
1994
fDate
25-28 Apr 1994
Firstpage
356
Lastpage
359
Abstract
Multichip packaging applications require bare die with high yield and reliability. Die-Level (test &) Burn-In (DLBI) approaches are just emerging. Targeting temporary die carrier development and application. In addition, strategic goals of IC manufacturers are driving development of Wafer-Level (test &) Burn-In (WLBI) to support more rapid reliability learning in manufacturing. This paper provides a critical look at the emerging KGD technology solutions with focus on temporary die carriers
Keywords
circuit reliability; integrated circuit manufacture; multichip modules; IC manufacture; MCM; bare die; die carrier development; die-level burn-in; high yield; known-good-die technologies; multichip packaging; reliability; wafer-level burn-in; Artificial intelligence; Automatic testing; Built-in self-test; Contracts; Costs; Integrated circuit testing; Manufacturing; Packaging; Petroleum; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Test Symposium, 1994. Proceedings., 12th IEEE
Conference_Location
Cherry Hill, NJ
Print_ISBN
0-8186-5440-6
Type
conf
DOI
10.1109/VTEST.1994.292289
Filename
292289
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