Title :
Thermal-mechanical stress analysis in embedded power modules
Author :
Zhu, N. ; van Wyk, J.D. ; Liang, Z.X.
Author_Institution :
Dept. of Electr. & Comput. Eng., Virginia Polytech. & State Univ., Blacksburg, VA, USA
Abstract :
Embedded power modules are examples of planar integration using metallization interconnections. Mechanical properties of interfaces between deposited copper traces and substrates are important for reliable operation. This paper investigates the values of thermal-mechanical stresses by IDEAS simulation. The effects of the deposited copper shape to the thermal-mechanical stress are illustrated in a simplified structure. Then a multi-layer structure of an embedded power module was modeled and the thermal-mechanical stresses of different layers were analyzed. The temperature cycling and power cycling test results are presented.
Keywords :
integrated circuit metallisation; power electronics; semiconductor device metallisation; stress analysis; thermal analysis; IDEAS simulation; embedded power modules; metallization interconnections; power cycling test; thermal-mechanical stress analysis; Copper; Dielectric substrates; Electronic packaging thermal management; Integrated circuit interconnections; Integrated circuit technology; Metallization; Multichip modules; Power electronics; Power system interconnection; Thermal stresses;
Conference_Titel :
Power Electronics Specialists Conference, 2004. PESC 04. 2004 IEEE 35th Annual
Print_ISBN :
0-7803-8399-0
DOI :
10.1109/PESC.2004.1354797
