Testing of integrated IGBT module/heat-pipe cooler system

Author

Fratelli, L. ; Manzo, R. ; Giannini, G.

Volume

6

fYear

2004

fDate

20-25 June 2004

Firstpage

4516

Abstract

A converter phase assembly demonstrator based on a heat pipe integrated with the AISiC baseplate of an IGBT module has been specified, designed and manufactured, and its performances have been tested. Full thermal characterization has been performed by measuring junction-ambient thermal impedance of the heat sink, for multiple power and air speed values, both in natural convection and in forced ventilation. Moreover reliability of critical regions of the items has been verified by ageing tests and thermal and acoustic analysis. It has been found that, for power lower than 1200 W, the integrated system thermal resistance is always lower than 80 °C/kW, in natural convention, whereas it is lower than 28 °C/kW in forced air ventilation at air speed of 3 m/s, so that the assembly is suited for fan-less traction converter in mass transit application, ventilation being ensured by vehicle motion only.

Keywords

heat pipes; heat sinks; insulated gate bipolar transistors; power convertors; thermal analysis; traction; AISiC baseplate; acoustic analysis; converter phase assembly demonstrator; fanless traction converter; forced air ventilation; heat-pipe cooler system; integrated IGBT module; junction-ambient thermal impedance measurement; mass transit application; thermal analysis; thermal characterization; vehicle motion; Acoustic measurements; Acoustic testing; Assembly; Insulated gate bipolar transistors; Manufacturing; Performance evaluation; System testing; Thermal force; Thermal resistance; Ventilation;

fLanguage

English

Publisher

ieee

Conference_Titel

Power Electronics Specialists Conference, 2004. PESC 04. 2004 IEEE 35th Annual

ISSN

0275-9306

Print_ISBN

0-7803-8399-0

Type

conf

DOI

10.1109/PESC.2004.1354799

Filename

1354799