• DocumentCode
    1871410
  • Title

    Micro devices integration with stretchable spring embedded in long PDMS-fiber for flexible electronics

  • Author

    Wei-Lun Sung ; Chao-Lin Cheng ; Weileun Fang

  • Author_Institution
    Dept. of Power Mech. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
  • fYear
    2015
  • fDate
    18-22 Jan. 2015
  • Firstpage
    423
  • Lastpage
    426
  • Abstract
    This study presents a PDMS (Polydimethylsiloxane) fiber integrated with multi devices scheme using stretchable electroplating copper spring. Each device was located on the node and embedded in PDMS-fiber. Thus, devices are mechanically connected by PDMS-fiber and electrically connected by inner stretchable spring. Thus, large-area and flexible applications can be achieved. Advantages of this approach: (1) length magnification by stretchable spring; (2) thicker stretchable spring embedded in PDMS provides well mechanical and electrical characteristics; (3) node acts as a hub for devices implementation and integration; (4) partially stretched spring could reduce the resistance variation by external loads. A 6.2cm PDMS-fiber with sensors and LED is implemented using a 2.4cm node-spring components fabricated on 4-inch wafer. PDMS-fiber longer than 30cm can be achieved using different spring design.
  • Keywords
    copper; electroplating; flexible electronics; micromechanical devices; springs (mechanical); Cu; electrical characteristics; flexible electronics; inner stretchable spring; length magnification; long PDMS-fiber; mechanical characteristics; microdevice integration; node-spring components; polydimethylsiloxane fiber; resistance variation; size 2.4 cm; size 4 inch; size 6.2 cm; stretchable electroplating copper spring; Copper; Light emitting diodes; Micromechanical devices; Sensors; Springs; Strain; Weaving;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2015 28th IEEE International Conference on
  • Conference_Location
    Estoril
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2015.7050980
  • Filename
    7050980