Title :
The finite-element model and analysis of static contact resistance and thermal process for contact with film
Author :
Kui, Li ; Xiuping, Su ; Zhigang, Li ; Jianguo, Lu ; Guansheng, Zhang
Author_Institution :
Hebei Univ. of Technol., Tianjin, China
Abstract :
Contact resistance and thermal process are very important parameters for contact. The film on contact surface has an influence on contact resistance and the thermal process. This paper has analyzed the static contact resistance and the thermal process, and then the finite-element models are proposed for contact with film. The contact boundary condition is automatically met in calculating the finite-element method for contact without film, but it will be changed when the contacts are covered with film. We have developed the finite-element program for contact with film. Our results for resistance of single-spot contact are approximate to the theoretical value. Finally we have analyzed the effect of the film on the thermal process.
Keywords :
contact resistance; electrical contacts; finite element analysis; contact boundary condition; finite-element model; single-spot contact; static contact resistance; thermal process; Boundary conditions; Conductive films; Contact resistance; Electric potential; Equations; Finite element methods; Temperature; Thermal conductivity; Thermal resistance; Voltage;
Conference_Titel :
Electrical Contacts, 1998. Proceedings of the Forty-Fourth IEEE Holm Conference on
Conference_Location :
Arlington, VA, USA
Print_ISBN :
0-7803-4925-3
DOI :
10.1109/HOLM.1998.722450