Correlating defect level to final test fault coverage for modular structured designs [microcontroller family]

The Texas Instruments TMS370 is in volume production. Sample manufacturing data has been collected to correlate stuck fault grades to the defect levels that would have been realized at those grades, at both the module and chip levels. Since the chip is composed of test isolatable modules, the data collected provide insights into the randomness of the distribution of failures among the modules. Further analysis shows good agreement between actual data and theoretical defect level model predictions. The data emphasize the need for hash fault coverages and correspondingly required DFT practices in today´s era of “Six Sigma” quality targets