DocumentCode :
1872146
Title :
Deposition temperature effect on a-Si:H produced by DC magnetron sputtering
Author :
Santana, R.J. ; Moura, Thiago D. O. ; Guimaraes, G.R. ; Miranda, D.O. ; Proenca, R.T. ; Diniz, A.S.C. ; Branco, J.R.T.
Author_Institution :
CETEC, Belo Horizonte, Brazil
fYear :
2011
fDate :
19-24 June 2011
Abstract :
The use of hydrogenated amorphous silicon, a-Si:H, for improving heterojunction solar cell efficiency and decreasing cost has found increasing interest in recent years. Hydrogen incorporation in thin films of amorphous silicon is crucial for obtaining high quality semiconductor because it passivates Si dangling bonds in the structure. In the present work the effect of deposition temperature in the hydrogen incorporation in a-Si:H films growth by DC magnetron sputtering in Ar-H plasma was studied. The films were deposited over glass and Silicon wafer substrates, and characterized by Raman, FTIR and UV-Vis techniques. The results showed that deposition temperature of 200°C gave an amorphous film with the highest level of hydrogenation about of 28%. The relatively high band gap, between 1,70 and 1.9 eV, is consistent with the significant presence of hydrogen in the amorphous silicon film.
Keywords :
Fourier transform spectra; argon compounds; glass; silicon compounds; solar cells; sputter deposition; thin films; ultraviolet spectra; visible spectra; Ar-H; Ar-H plasma; DC magnetron sputtering; FTIR technique; Raman technique; Si:H; UV-Vis technique; amorphous silicon film; deposition temperature effect; glass; heterojunction solar cell efficiency; hydrogen incorporation; hydrogenated amorphous silicon; passivates silicon dangling bond; silicon wafer substrate; temperature 200 C; thin film; Amorphous magnetic materials; Amorphous silicon; Films; Photonic band gap; Photovoltaic cells; Sputtering;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Photovoltaic Specialists Conference (PVSC), 2011 37th IEEE
Conference_Location :
Seattle, WA
ISSN :
0160-8371
Print_ISBN :
978-1-4244-9966-3
Type :
conf
DOI :
10.1109/PVSC.2011.6186593
Filename :
6186593
Link To Document :
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