DocumentCode :
1872680
Title :
Optimizing Floating Body Effect & AC performance in 65nm PD-SOI CMOS
Author :
Huang, R.M. ; Chen, T.F. ; Hong, S.F. ; Lin, Y.H. ; Tsai, T.L. ; Liu, E.C. ; Yang, C.W. ; Hsieh, Y.S. ; Huang, Y.T. ; Pelloie, J.L. ; Tsai, C.T. ; Ma, G.H.
Author_Institution :
United Microelectron. Corp. (UMC), Tainan
fYear :
2007
fDate :
1-4 Oct. 2007
Firstpage :
107
Lastpage :
108
Abstract :
An advanced partially-depleted (PD) silicon-on-insulator (SOI) CMOS device was optimized with full consideration of the floating body effect (FBE) using channel and S/D engineering. By adjusting channel and S/D implants´ species and dosage, the S/D doping profiles across transistor sidewall junction will be shown to reduce floating body effects and sidewall junction capacitance. Reduced sidewall junction capacitance results in higher performance in AC operation. In this paper we successfully demonstrated the optimized devices that exhibit suppression floating body effect, and lower ring oscillator (RO) static leakage and active power consumption at the same propagation delay.
Keywords :
CMOS integrated circuits; nanoelectronics; silicon-on-insulator; AC performance; PD-SOI CMOS; S/D doping profiles; active power consumption; advanced partially-depleted silicon-on-insulator CMOS device; floating body effect; lower ring oscillator; sidewall junction capacitance; size 65 nm; static leakage; transistor sidewall junction; CMOS technology; Capacitance; Doping profiles; Energy consumption; Impact ionization; Implants; Leakage current; MOS devices; Silicon on insulator technology; Threshold voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
SOI Conference, 2007 IEEE International
Conference_Location :
Indian Wells, CA
ISSN :
1078-621X
Print_ISBN :
978-1-4244-0879-5
Electronic_ISBN :
1078-621X
Type :
conf
DOI :
10.1109/SOI.2007.4357875
Filename :
4357875
Link To Document :
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