DocumentCode :
1872816
Title :
Evaluation of embedded heat extraction for high power density integrated electromagnetic power passives
Author :
Dirker, J. ; Liu, W. ; van Wyk, J.D. ; Meyer, J.P.
Author_Institution :
Dept. of Mech. Eng., Rand Afrikaans Univ., South Africa
Volume :
6
fYear :
2004
fDate :
20-25 June 2004
Firstpage :
4888
Abstract :
The use of embedded solid-state heat extractors to increase the power densities in power electronic modules seems promising. Cross-sectional geometric optimisation was done on heat extraction insert and it was found that the most suitable heat extraction configuration for application in power electronics is the use of flat continuous heat extraction layers aiding in conducting heat to externally mounted heat sinks. Theoretic expected thermal enhancement factors were determined and experimentally verified. Interfacial thermal resistances adversely influence the effectiveness of heat extraction inserts and should be minimised.
Keywords :
heat sinks; optimisation; power electronics; cross-sectional geometric optimisation; embedded heat extraction; embedded solid-state heat extractor; heat sink; integrated electromagnetic power passive; interfacial thermal resistance; power electronic module; thermal enhancement factor; Africa; Conducting materials; Electromagnetic heating; Heat sinks; Magnetic materials; Power electronics; Resistance heating; Solid state circuits; Thermal conductivity; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Electronics Specialists Conference, 2004. PESC 04. 2004 IEEE 35th Annual
ISSN :
0275-9306
Print_ISBN :
0-7803-8399-0
Type :
conf
DOI :
10.1109/PESC.2004.1354864
Filename :
1354864
Link To Document :
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