Title :
Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153)
Abstract :
The following topics were dealt with: polymer dielectric materials; advanced board materials and processes; encapsulates and BGAs; integrated passives; plastic package materials; direct chip attach materials; microwave materials; and ceramic materials
Keywords :
ceramics; dielectric materials; encapsulation; packaging; plastic packaging; polymers; printed circuits; BGAs; board materials; board processes; ceramic materials; direct chip attach materials; encapsulates; integrated passives; microwave materials; packaging materials; plastic package materials; polymer dielectric materials;
Conference_Titel :
Advanced Packaging Materials, 1998. Proceedings. 1998 4th International Symposium on
Conference_Location :
Braselton, GA, USA
Print_ISBN :
0-7803-4795-1
DOI :
10.1109/ISAPM.1998.664423
