DocumentCode
1873012
Title
Exploring silica powder and its effect on a flip chip underfill encapsulant
Author
Klimah, Paul ; Liu, Jean
fYear
1998
fDate
15-18 Mar 1998
Firstpage
12
Lastpage
15
Abstract
Certain properties of silica powder can influence flip chip production, especially in the process of encapsulation and set-up time. Our study of the silica used in encapsulants shows that the particle distribution of the silica has a direct relationship with the viscosity of the encapsulant, which contains the silica. We also found that the analysts for the ranges of particle distribution serves as an excellent tool for relating the particle size with its viscosity
Keywords
encapsulation; flip-chip devices; integrated circuit packaging; particle size; viscosity; IC packaging; SiO2; epoxy underfill; flip chip; particle distribution; particle size; set-up time; underfill encapsulant; viscosity; Flip chip; Particle measurements; Powders; Rheology; Scanning electron microscopy; Silicon compounds; Soldering; Surface structures; Testing; Viscosity;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Packaging Materials, 1998. Proceedings. 1998 4th International Symposium on
Conference_Location
Braselton, GA
Print_ISBN
0-7803-4795-1
Type
conf
DOI
10.1109/ISAPM.1998.664426
Filename
664426
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