DocumentCode :
1873099
Title :
Advances in flip chip underfill material cure rates and reliability
Author :
Shi, Daqing Max ; McKeen, Kathy ; Jenson, Bill
Author_Institution :
Thermoset Plastics Inc., Indianapolis, IN, USA
fYear :
1998
fDate :
15-18 Mar 1998
Firstpage :
29
Lastpage :
32
Abstract :
This paper will focus on significant advances in improving flip chip underfill material cure rates under conventional cure mechanism and in improving the material´s reliability, which significantly improves semiconductor packaging productivity. The material´s cure rates as a function of time and temperature will be examined and presented by data generated by differential scanning calorimetry (DSC). DSC will also be used to examine the glass transition temperature of the optimum cure time and cure temperature. The material´s linear coefficient of thermal expansion will be examined by thermomechanical analyzer (TMA). Other material physical properties such as shear strength and moisture absorption rate will be examined and presented. The reliability data from liquid-liquid thermal shock tests on actual flip chip devices using such material and optimum cure schedule will also be presented
Keywords :
encapsulation; flip-chip devices; integrated circuit packaging; integrated circuit reliability; shear strength; thermal analysis; thermal expansion; thermal shock; cure mechanism; cure rates; cure schedule; cure temperature; cure time; differential scanning calorimetry; flip chip underfill material; glass transition temperature; linear coefficient of thermal expansion; liquid-liquid thermal shock tests; moisture absorption rate; reliability; reliability data; semiconductor packaging productivity; shear strength; thermomechanical analyzer; Calorimetry; Flip chip; Glass; Materials reliability; Productivity; Semiconductor device packaging; Semiconductor materials; Temperature; Thermal expansion; Thermomechanical processes;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Packaging Materials, 1998. Proceedings. 1998 4th International Symposium on
Conference_Location :
Braselton, GA
Print_ISBN :
0-7803-4795-1
Type :
conf
DOI :
10.1109/ISAPM.1998.664429
Filename :
664429
Link To Document :
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