DocumentCode
1873119
Title
A thermal annealing of ion-implanted silicon
Author
Lojek, B. ; Whiteman, M. ; Ahrenkiel, R.
Author_Institution
Atmel Corp., Colorado Springs, CO, USA
fYear
2001
fDate
2001
Firstpage
125
Lastpage
131
Abstract
The experimental work reported in this paper has confirmed that Rapid Thermal Annealing in the presence of optical excitation has a significant athermal component of annealing. It is suggested that the origin of athermal component annealing is related to the energy localization in the vicinity of deep level defects which may be in metastable state after optical excitation. The fact that these kind of states cannot be achieved by thermal annealing may be the reason for differences between thermal annealing (in dark) and annealing in the presence of optical irradiation. It is demonstrated that athermal annealing can be use for typical annealing application such as S/D anneal of submicron devices. Sheet resistance, SIMS profile and bulk lifetime were measured. Parametric test data are presented for typical logic ASIC process.
Keywords
carrier lifetime; deep levels; elemental semiconductors; ion implantation; rapid thermal annealing; secondary ion mass spectra; silicon; SIMS profile; Si; athermal annealing; bulk lifetime; deep level defect; energy localization; ion implanted silicon; logic ASIC process; metastable state; optical irradiation; parametric testing; rapid thermal annealing; sheet resistance; source/drain junction; submicron device; Crystalline materials; Lamps; Logic testing; Optical devices; Optical films; Rapid thermal annealing; Rapid thermal processing; Semiconductor device modeling; Silicon; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Thermal Processing of Semiconductors 9th Internationa Conference on RTP 2001
Print_ISBN
0-9638251-0-4
Type
conf
DOI
10.1109/RTP.2001.1013755
Filename
1013755
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