• DocumentCode
    1873119
  • Title

    A thermal annealing of ion-implanted silicon

  • Author

    Lojek, B. ; Whiteman, M. ; Ahrenkiel, R.

  • Author_Institution
    Atmel Corp., Colorado Springs, CO, USA
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    125
  • Lastpage
    131
  • Abstract
    The experimental work reported in this paper has confirmed that Rapid Thermal Annealing in the presence of optical excitation has a significant athermal component of annealing. It is suggested that the origin of athermal component annealing is related to the energy localization in the vicinity of deep level defects which may be in metastable state after optical excitation. The fact that these kind of states cannot be achieved by thermal annealing may be the reason for differences between thermal annealing (in dark) and annealing in the presence of optical irradiation. It is demonstrated that athermal annealing can be use for typical annealing application such as S/D anneal of submicron devices. Sheet resistance, SIMS profile and bulk lifetime were measured. Parametric test data are presented for typical logic ASIC process.
  • Keywords
    carrier lifetime; deep levels; elemental semiconductors; ion implantation; rapid thermal annealing; secondary ion mass spectra; silicon; SIMS profile; Si; athermal annealing; bulk lifetime; deep level defect; energy localization; ion implanted silicon; logic ASIC process; metastable state; optical irradiation; parametric testing; rapid thermal annealing; sheet resistance; source/drain junction; submicron device; Crystalline materials; Lamps; Logic testing; Optical devices; Optical films; Rapid thermal annealing; Rapid thermal processing; Semiconductor device modeling; Silicon; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Thermal Processing of Semiconductors 9th Internationa Conference on RTP 2001
  • Print_ISBN
    0-9638251-0-4
  • Type

    conf

  • DOI
    10.1109/RTP.2001.1013755
  • Filename
    1013755